super bright oval type led lamps data sheet doc. no : qw0905- rev. : a date : LHRF13430-PF LHRF13430-PF pb lead-free parts ligitek electronics co.,ltd. property of ligitek only - 2007 22 - jan.
+ - page 1/5 part no. package dimensions LHRF13430-PF ligitek electronics co.,ltd. property of ligitek only 5.0 4.31 7.4 1.5max 1.0min 2.54typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 0.5 typ 25.0min directivity radiation 0 60 vertical axis 30 30 -60 -30 horizontal axis 50 100% 50%75% 25% 0 25% 75% 100% radiation angle(0.5):h 50 degree/v 30 degree 50%
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) t opr operating temperature color part no LHRF13430-PF emitted red algainp material lens red diffused storage temperature tstg i f forward current power dissipation reverse current @5v electrostatic discharge( * ) peak forward current duty 1/10@10khz esd ir pd i fp parameter symbol -40 ~ +85 viewing angle 2 1/2 (deg) forward voltage @ ma(v) dominant wave length dnm spectral halfwidth nm luminous intensity @20ma(mcd) 20 min. 63020 1.5 min. max. typ. 450 2.4700 -40 ~ +100 page2/5 30 ma 2000 10 v a 75 90 mw ma hrf ratings unit ligitek electronics co.,ltd. property of ligitek only static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * LHRF13430-PF part no. vertical axis 30 horizontal axis 50
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 wavelength (nm) 550 0 700 650 0.5 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) fig.5 relative intensity vs. wavelength 1.0 ambient temperature( ) 0.8 -0 -20 -4060 40 2080100 0 -40-20-060 4080100 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 100 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 1.5 1.0 0.1 2.5 2.03.01.010 0 1.0 10 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 1000 3.5 2.5 typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 3.0 hrf chip page 3/5 LHRF13430-PF part no.
temp( c) 25 0 0 120 260 2 /sec max preheat 50 5 /sec max 100 260 c3sec max 150 time(sec) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile page 4/5 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. LHRF13430-PF part no.
6/6 page description the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition test item 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. low temperature storage test high temperature storage test operating life test thermal shock test high temperature high humidity test reliability test: this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 LHRF13430-PF part no.
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